The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Oct. 10, 2022
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Klaas De Haan, Berltsum, NL;

Mikhail Valeryevich Ivanov, Freising, DE;

Tobias Bernhard Fritz, Mainburg, DE;

Swaminathan Sankaran, Allen, TX (US);

Thomas Dyer Bonifield, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/50 (2006.01); H01L 23/50 (2006.01); H04L 25/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 21/50 (2013.01); H01L 23/50 (2013.01); H01L 23/5222 (2013.01); H04L 25/0268 (2013.01);
Abstract

An electronic device has a substrate and first and second metallization levels with a resonant circuit. The first metallization level has a first dielectric layer on a side of the substrate, and a first metal layer on the first dielectric layer. The second metallization level has a second dielectric layer on the first dielectric layer and the first metal layer, and a second metal layer on the second dielectric layer. The electronic device includes a first plate in the first metal layer, and a second plate spaced apart from the first plate in the second metal layer to form a capacitor. The electronic device includes a winding in one of the first or second metal layers and coupled to one of the first or second plates in a resonant circuit.


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