The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Dec. 21, 2021
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Akihiro Fukatsu, Kariya, JP;

Noboru Nagase, Kariya, JP;

Toshihiro Nagaya, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/07 (2006.01); H01L 25/16 (2023.01); H02M 1/08 (2006.01); H02M 7/537 (2006.01); H02P 27/06 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49537 (2013.01); H01L 23/49575 (2013.01); H01L 25/072 (2013.01); H01L 25/162 (2013.01); H02M 1/08 (2013.01); H02M 7/537 (2013.01); H05K 1/181 (2013.01); H01L 23/3121 (2013.01); H01L 23/49513 (2013.01); H01L 24/32 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/3716 (2013.01); H01L 2224/40175 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1433 (2013.01); H02P 27/06 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A semiconductor device includes: first and second semiconductor elements each having two electrodes respectively disposed on two surfaces; two first terminals respectively connected to the two electrodes of the first semiconductor element and arranged side by side in one direction; two second terminals respectively connected to the two electrodes of the second semiconductor element, and arranged side by side in the one direction to be adjacent to the two first terminals; and a sealing resin portion covering the first and second semiconductor elements and the first and second terminals in a state where facing surfaces of the first and second terminals are exposed from the sealing resin portion. The facing surfaces of the two first terminals have different area ratios, the facing surfaces of the two second terminals have different area ratios, and one of the first terminals is arranged adjacent to both the two second terminals.


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