The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Oct. 23, 2020
Mitsubishi Electric Corporation, Tokyo, JP;
Hiroyuki Masumoto, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device includes a base plate, a semiconductor chip, a case, a heat dissipation member, and a plurality of attachment portions. The semiconductor chip is held on a front surface side of the base plate. The case is provided on a front surface of the base plate so as to house the semiconductor chip inside. The heat dissipation member is provided on a back surface of the base plate and contactable with a heat sink for cooling the semiconductor chip. The plurality of attachment portions have a function of attaching the case to the heat sink. Ends of the heat dissipation member in a direction extending along a long side of a plurality of sides that form a shape defined by connecting positions of the plurality of attachment portions in plan view are located between the two attachment portions that form the long side.