The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Nov. 02, 2020
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/053 (2006.01); H01L 23/08 (2006.01); H01L 23/18 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 23/08 (2013.01); H01L 23/18 (2013.01); H01L 23/49811 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01);
Abstract
Implementations of a semiconductor package may include: a substrate, a case coupled to the substrate, and a plurality of press-fit pins. The plurality of press-fit pins may be fixedly coupled with the case. The plurality of press-fit pins may have at least one locking portion that extends from a side of the plurality of press-fit pins into the case and the plurality of press-fit pins may be electrically and mechanically coupled to the substrate.