The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Dec. 09, 2021
Applicant:
Amazon Technologies, Inc., Seattle, WA (US);
Inventor:
Nikhil Jayakumar, San Jose, CA (US);
Assignee:
Amazon Technologies, Inc., Seattle, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); H01L 23/49811 (2013.01); H01L 23/50 (2013.01); H01L 24/14 (2013.01); H01L 2224/1412 (2013.01);
Abstract
A semiconductor package component (such as a die or interposer) can include a body having a top surface and a bottom surface. The component can further include an interface array arranged along the top surface or the bottom surface. The interface array can include a first set of microbumps arranged in a first row. The interface array can further include a second set of microbumps arranged in a second row adjacent the first row. The interface array can also include a probe pad extending into both the first row and the second row.