The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Nov. 01, 2019
Applicant:

Raintree Scientific Instruments (Shanghai) Corporation, Shanghai, CN;

Inventors:

Bin Li, Shanghai, CN;

Haijun Gao, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/12 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 21/67253 (2013.01); H01L 21/681 (2013.01);
Abstract

The present disclosure relates to a device and method for measuring wafers. The device comprises: a moving platform, which is used to adjust the location of wafers; a first pre-alignment module and a first image recognition module, which are used to align a first wafer at a first location on the moving platform before measuring the first wafer; a second pre-alignment module and a second image recognition module, which are used to align a second wafer at a second location on the moving platform before measuring the second wafer; and a measurement module, which is used to measure the first wafer and the second wafer at a third location on the moving platform, wherein the first location, second location and third location are different from each other. The embodiments of the present disclosure may improve the measurement efficiency of the device.


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