The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Mar. 01, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sangmin Kim, Yongin-si, KR;

Youngwook Kim, Seoul, KR;

Ginam Park, Incheon, KR;

Chuljun Park, Seoul, KR;

Jeongjae Bang, Suwon-si, KR;

Jaesung Byun, Suwon-si, KR;

Yongjun Ahn, Suwon-si, KR;

Sangkyung Lee, Hwaseong-si, KR;

Hyunwoo Lee, Hwaseong-si, KR;

Junhyuk Chang, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); B65G 1/06 (2006.01); B65G 1/127 (2006.01); H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67766 (2013.01); B65G 1/06 (2013.01); B65G 1/127 (2013.01); H01L 21/67379 (2013.01); H01L 21/6773 (2013.01); B65G 2201/0297 (2013.01);
Abstract

A transfer apparatus includes a lower plate including a lower link arm and a lower support, the lower support being fixed to an upper surface of the lower plate, an upper plate on the lower plate and configured to support a wafer stacking box on an upper surface of the upper plate, the upper plate including an upper link arm, and an upper support that is fixed to the upper surface of the upper plate, and a fixing member that is connected to the upper link arm, the fixing member configured to selectively contact the wafer stacking box. The upper plate is aligned with the lower plate in a first horizontal direction, and is configured to perform linear movement on the lower plate in the first horizontal direction.


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