The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Jun. 10, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Philip Allan Kraus, San Jose, CA (US);

Robert Moore, Bigfork, MT (US);

James Carducci, Sunnyvale, CA (US);

Richard Fovell, San Jose, CA (US);

Sathya Swaroop Ganta, Sunnyvale, CA (US);

Karthikeyan Balaraman, Bangalore, IN;

Silverst Rodrigues, Bangalore, IN;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32467 (2013.01); H01J 37/3222 (2013.01); H01J 37/3244 (2013.01); H01J 37/32513 (2013.01);
Abstract

Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.


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