The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Oct. 07, 2019
Applicant:

Smoltek Ab, Gothenburg, SE;

Inventors:

Vincent Desmaris, Gothenburg, SE;

Rickard Andersson, Gothenburg, SE;

Muhammad Amin Saleem, Gothenburg, SE;

Maria Bylund, Gothenburg, SE;

Anders Johansson, Öckerö, SE;

Fredrik Liljeberg, Gothenburg, SE;

Ola Tiverman, Västra Frölunda, SE;

M Shafiqul Kabir, Västra Frölunda, SE;

Assignee:

SMOLTEK AB, Gothenburg, SE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 11/36 (2013.01); H01G 11/56 (2013.01); H01M 10/0585 (2010.01); H01M 50/11 (2021.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01G 11/36 (2013.01); H01G 11/56 (2013.01); H01M 10/0585 (2013.01); H01M 50/11 (2021.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10037 (2013.01);
Abstract

A discrete metal-insulator-metal (MIM) energy storage component, the energy storage component comprising: a MIM-arrangement comprising: a first electrode layer; a plurality of conductive nanostructures grown from the first electrode layer; a conduction controlling material covering each nanostructure in the plurality of conductive nanostructures and the first electrode layer uncovered by the conductive nanostructures; and a second electrode layer covering the conduction controlling material; a first connecting structure for external electrical connection of the capacitor component; a second connecting structure for external electrical connection of the capacitor component; and an electrically insulating encapsulation material at least partly embedding the MIM-arrangement.


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