The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Aug. 11, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Joung Gul Ryu, Suwon-si, KR;

Byeong Cheol Moon, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/30 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/30 (2013.01); H01F 41/041 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A coil component includes a support substrate, a coil portion disposed on the support substrate, and a body in which the support substrate and the coil portion are disposed. The coil portion includes a coil pattern portion, a lower pattern portion connected to the coil pattern portion and disposed on one surface of the support substrate, a dummy pattern portion disposed to overlap the lower pattern portion on another surface of the support substrate opposite to the one surface, and a through-via penetrating through the support substrate and connecting the lower pattern portion and the dummy pattern portion to each other. The lower pattern portion and the dummy pattern portion are externally exposed through one surface of the body. The through-via has one surface externally exposed through the one surface of the body.


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