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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12033426 B1

PDFFull Text
Date of Patent:
Jul. 09, 2024

Filed:

Sep. 21, 2021

Thermally conductive and protective coating for electronic device

Applicant:

Next Biometrics Group Asa, Oslo, NO;

Inventors:

Matias N. Troccoli, Kirkland, WA (US);

Tian Xiao, Everett, WA (US);

Assignee:

NEXT Biometrics Group ASA, Oslo, NO;

Attorney:

Duane Morris LLP

Primary Examiner:

Jeffrey A Vonch

Int. Cl.
CPC ...
B32B 7/022 (2019.01); C23C 28/00 (2006.01); C23C 28/04 (2006.01); G06V 40/13 (2022.01); H01L 23/28 (2006.01); B32B 17/06 (2006.01); B32B 17/10 (2006.01); B32B 27/06 (2006.01); C23C 14/06 (2006.01); C23C 16/26 (2006.01); C23C 16/30 (2006.01); C23C 16/34 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
G06V 40/1329 (2022.01); B32B 7/022 (2019.01); C23C 28/046 (2013.01); C23C 28/048 (2013.01); C23C 28/40 (2013.01); C23C 28/42 (2013.01); C23C 28/44 (2013.01); H01L 23/28 (2013.01); B32B 17/06 (2013.01); B32B 17/10 (2013.01); B32B 27/06 (2013.01); B32B 2250/40 (2013.01); B32B 2250/42 (2013.01); B32B 2255/20 (2013.01); B32B 2255/24 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2307/204 (2013.01); B32B 2307/302 (2013.01); B32B 2307/554 (2013.01); B32B 2307/558 (2013.01); B32B 2307/584 (2013.01); B32B 2307/702 (2013.01); B32B 2307/704 (2013.01); B32B 2313/04 (2013.01); B32B 2315/00 (2013.01); B32B 2327/12 (2013.01); B32B 2457/00 (2013.01); B32B 2457/14 (2013.01); C23C 14/0605 (2013.01); C23C 14/0641 (2013.01); C23C 14/0647 (2013.01); C23C 16/26 (2013.01); C23C 16/303 (2013.01); C23C 16/34 (2013.01); C23C 16/342 (2013.01); C23C 28/04 (2013.01); G06V 40/1306 (2022.01); H01L 23/29 (2013.01); H01L 23/291 (2013.01); H01L 23/3192 (2013.01); H01L 23/562 (2013.01); Y10S 428/9088 (2013.01); Y10T 428/24942 (2015.01); Y10T 428/24983 (2015.01); Y10T 428/3154 (2015.04);
Abstract

A protective coating layer, an electronic device including such a protective coating layer, and the methods of making the same are provided. The electronic device includes a substrate, a thin film circuit layer disposed over the substrate, and a protective coating layer disposed over the thin film circuit layer. The protective coating layer includes a first coating and a second coating disposed over the first coating. Each coating has a cross-plane thermal conductivity in a direction normal to a respective coating surface equal to or higher than 0.5 W/(m*K). The first coating and the second coating have different crystal or amorphous structures, different crystalline orientations, different compositions, or a combination thereof to provide different nanoindentation hardness. The first coating has a hardness lower than that of the second coating.

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