The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Jun. 22, 2022
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Daniel Joseph Linnen, Naperville, IL (US);

Ramanathan Muthiah, Bangalore, IN;

Kirubakaran Periyannan, Saratoga, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 9/30 (2018.01); G06F 9/345 (2018.01); G06F 15/78 (2006.01); G06F 7/544 (2006.01); G06N 3/063 (2023.01);
U.S. Cl.
CPC ...
G06F 9/3001 (2013.01); G06F 9/3004 (2013.01); G06F 9/30098 (2013.01); G06F 9/345 (2013.01); G06F 15/7821 (2013.01); G06F 7/5443 (2013.01); G06N 3/063 (2013.01);
Abstract

Latch-based multiply-accumulate (MAC) operations implemented on the die of a non-volatile memory (NVM) array are disclosed. The exemplary latch-based MAC procedures described herein are linear procedures that do not require logic branches. In one example, the MAC operation uses a set of linear MAC stages, wherein each linear stage processes MAC operations corresponding to one bit of a first multi-bit multiplicand being multiplied against a second multi-bit multiplicand. Examples are provided wherein the MAC procedures are performed as part of a neural network feedforward procedure where the first multiplicand is a synaptic weight and the second multiplicand is an activation value. Multiple plane and multiple die NVM array implementations are also described for massive parallel processing.


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