The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Sep. 08, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Krishna T. Malladi, San Jose, CA (US);
Hongzhong Zheng, Los Gatos, CA (US);
Dimin Niu, Sunnyvale, CA (US);
Peng Gu, Santa Barbara, CA (US);
Assignee:
Samsung Electronics Co., Ltd., Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/16 (2006.01); G06F 7/544 (2006.01); G06F 9/30 (2018.01);
U.S. Cl.
CPC ...
G06F 13/1652 (2013.01); G06F 7/5443 (2013.01); G06F 9/30014 (2013.01); G06F 9/30036 (2013.01); G06F 13/1694 (2013.01);
Abstract
A high bandwidth memory (HBM) system includes a first HBM+ card. The first HBM+ card includes a plurality of HBM+ cubes. Each HBM+ cube has a logic die and a memory die. The first HBM+ card also includes a HBM+ card controller coupled to each of the plurality of HBM+ cubes and configured to interface with a host, a pin connection configured to connect to the host, and a fabric connection configured to connect to at least one HBM+ card.