The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Apr. 03, 2019
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Lars Martin Otfried Brusberg, Corning, NY (US);

Jin Su Kim, Seoul, KR;

Aramais Robert Zakharian, Painted Post, NY (US);

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); C03C 3/04 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4281 (2013.01); C03C 3/04 (2013.01); H05K 1/0274 (2013.01); H05K 1/0306 (2013.01); H05K 3/0011 (2013.01);
Abstract

Integrated circuit packages () having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a structured glass article () including a glass substrate (), an optical channel (), and redistribution layers. The integrated circuit package () further includes an integrated circuit chip () positioned on the glass substrate () and in optical communication with the optical channel () and in electrical continuity with the redistribution layers ().


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