The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Aug. 17, 2020
Applicant:

Nissha Co., Ltd., Kyoto, JP;

Inventors:

Chuzo Taniguchi, Kyoko, JP;

Ryomei Omote, Kyoko, JP;

Junichi Shibata, Kyoko, JP;

Jun Sasaki, Kyoko, JP;

Yoshihiro Sakata, Kyoko, JP;

Toshifumi Kurosaki, Kyoko, JP;

Shohei Morimoto, Kyoko, JP;

Assignee:

NISSHA CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 8/00 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01); B29L 31/34 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 33/54 (2010.01); H10K 50/844 (2023.01); H10K 50/858 (2023.01); H10K 71/00 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
G02B 6/0021 (2013.01); B29C 45/14688 (2013.01); B29C 45/1671 (2013.01); G02B 6/0065 (2013.01); H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H10K 50/844 (2023.02); H10K 50/858 (2023.02); H10K 71/00 (2023.02); B29K 2995/0025 (2013.01); B29K 2995/0026 (2013.01); B29L 2031/3475 (2013.01); G02B 6/0068 (2013.01); G02B 6/0073 (2013.01); H01L 25/167 (2013.01); H01L 2933/005 (2013.01); H10K 2102/351 (2023.02);
Abstract

An illumination display panel that forms part of a housing and has a display portion for illuminated display comprises a resin panel having a first molded portion made of an opaque resin at a portion excluding the display portion, and a second molded portion disposed on the back surface side of the first molded portion and made of a light-transmitting resin having a protrusion where the first molded portion is not present. The protrusion is fitted to the first molded portion. A light source mounting substrate is disposed on the back surface side of the resin panel. At least a light source of the light source mounting substrate is sealed by the second molded portion. An integrally molded product of the light source mounting substrate and the second molded portion is filled and solidified at a low pressure while compressing a cavity of a molding mold.


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