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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12031023 B1

PDFFull Text
Date of Patent:
Jul. 09, 2024

Filed:

Feb. 08, 2019

Resin composition and monolayer and multilayer films

Applicant:

Mitsui Chemicals, Inc., Tokyo, JP;

Inventors:

Akihiko Iwashita, Rye Brook, NY (US);

Yoshiyuki Ogawa, Chiba, JP;

Youhei Houtani, Shanghai, CN;

Assignee:

Mitsui Chemicals, Inc., , JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Sheeba Ahmed

Int. Cl.
CPC ...
C08L 23/12 (2006.01); B29C 48/08 (2019.01); B65D 65/40 (2006.01); C09J 123/12 (2006.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/124 (2021.01); H01M 50/126 (2021.01); H01M 50/131 (2021.01); H01M 50/14 (2021.01); B29K 23/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
C08L 23/12 (2013.01); B29C 48/08 (2019.02); B65D 65/40 (2013.01); C09J 123/12 (2013.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/124 (2021.01); H01M 50/126 (2021.01); H01M 50/131 (2021.01); H01M 50/14 (2021.01); B29K 2023/06 (2013.01); B29K 2023/08 (2013.01); B29K 2023/12 (2013.01); B29K 2023/14 (2013.01); B29K 2105/0085 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract

Resin composition comprises 35 to 59.9 parts by mass of a propylene polymer (A) satisfying below; 25 to 40 parts by mass of a soft propylene copolymer (B); 0.1 to 10 parts by mass of a polyolefin (C) containing a structural unit derived from an unsaturated carboxylic acid and/or a derivative thereof; and 15 to 30 parts by mass of an ethylene polymer (D) (provided that the total of (A), (B), (C), and (D) is 100 parts by mass), wherein an MFR measured at 230° C. and a load of 2.16 kg according to ASTM D-1238 is 7 g/10 min or more and 25 g/10 min or less, with each component satisfying certain requirements.

Find Patent Forward Citations

Iwashita, Akihiko. (2024). Resin composition and monolayer and multilayer films (U.S. Patent No. 12031023). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12031023

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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