The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Dec. 17, 2021
High strength and high thermal conductivity polyethylene thin film having a bimodal molecular weight
Meta Platforms Technologies, Llc, Menlo Park, CA (US);
Sheng Ye, Redmond, WA (US);
Andrew John Ouderkirk, Kirkland, WA (US);
Arman Boromand, Issaquah, WA (US);
Christopher Stipe, Woodinville, WA (US);
Hao Mei, Redmond, WA (US);
Christopher Yuan Ting Liao, Seattle, WA (US);
Meta Platforms Technologies, LLC, Menlo Park, CA (US);
Abstract
An optically clear, high strength, high modulus, and high thermal conductivity polyethylene thin film may be formed from a crystallizable polymer and an additive configured to interact with the crystallizable polymer to facilitate crystallite alignment and, in some examples, create a higher crystalline content within the polyethylene thin film. The polyethylene thin film may be characterized by a bimodal molecular weight distribution where the molecular weight of the additive may be less than approximately 5% of the molecular weight of the crystallizable polymer. Example crystallizable polymers may include high molecular weight polyethylene, high density polyethylene, and ultra-high molecular weight polyethylene. Example additives may include low molecular weight polyethylene and polyethylene oligomers. The polyethylene thin film may be characterized by a Young's modulus of at least approximately 10 GPa, a tensile strength of at least approximately 0.7 GPa, and a thermal conductivity of at least approximately 5 W/mK.