The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Feb. 06, 2020
Applicant:

Nippon Steel Corporation, Tokyo, JP;

Inventors:

Nobuo Kadowaki, Tokyo, JP;

Kazushi Iwakiri, Tokyo, JP;

Tomohiro Mizutani, Tokyo, JP;

Satoshi Kato, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/09 (2006.01); B32B 15/18 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B65D 6/00 (2006.01); B65D 6/32 (2006.01); B65D 8/00 (2006.01); B65D 17/00 (2006.01); C08L 23/14 (2006.01);
U.S. Cl.
CPC ...
B65D 7/38 (2013.01); B32B 15/09 (2013.01); B32B 15/18 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B65D 7/04 (2013.01); B32B 2270/00 (2013.01); B32B 2307/732 (2013.01); B32B 2439/66 (2013.01); C08L 23/14 (2013.01);
Abstract

A can lid made of a resin laminate steel sheet for a resin-metal composite container, includes: a top sheet portion; and a curved portion located at an outer periphery of the top sheet portion, in which the resin laminate steel sheet includes a steel sheet, a thermoplastic polyester-based resin layer provided at a first surface of the steel sheet, a modified polypropylene-based resin layer provided at a second surface of the steel sheet, a polypropylene-based resin layer, and an ethylene-propylene copolymer resin layer, a melting point of the ethylene-propylene copolymer resin layer is 135° C. or higher and 150° C. or lower, a melting point of the thermoplastic polyester-based resin layer is higher than a melting point of the polypropylene-based resin layer by 40° C. or more, and a range of a proportion of the ethylene component in the ethylene-propylene copolymer in the ethylene-propylene copolymer resin layer is 1.0 mass % or more and 45.0 mass % or less.


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