The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
May. 08, 2020
The Yokohama Rubber Co., Ltd., Tokyo, JP;
Takashi Kidesaki, Kanagawa, JP;
The Yokohama Rubber Co., LTD., Tokyo, JP;
Abstract
A tire molding die includes sectors separated from one another in a tire circumferential direction, and sipe blades disposed on tread molding surfaces of the sectors, the sipe blades are disposed repeatedly in the tire circumferential direction in a repeating pattern corresponding to a predetermined arrangement pattern, and a near sipe blade that is included in sipe blades disposed in one of the sectors and that is a sipe blade closest to a division position between the sectors is more rigid than an original shape blade corresponding to the sipe blade provided in the repeating pattern differing from the repeating pattern including the near sipe blade at a position identical to a position of the near sipe blade in the repeating pattern including the near sipe blade.