The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Jun. 14, 2019
Applicant:
Mitsubishi Chemical Corporation, Tokyo, JP;
Inventors:
Norihito Sakai, Tokyo, JP;
Kenji Kato, Tokyo, JP;
Assignee:
MITSUBISHI CHEMICAL CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/118 (2017.01); B33Y 70/00 (2020.01); B29K 23/00 (2006.01); B29L 9/00 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B33Y 70/00 (2014.12); B29K 2023/086 (2013.01); B29L 2009/00 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12);
Abstract
The present invention provides a molding material excellent in dimensional stability and operation safety during surface treatment after molding. The molding material according to the present invention is for use in molding by a hot melt lamination method and contains an ethylene-vinyl alcohol copolymer.