The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Oct. 06, 2020
Applicant:

Milacron Llc, Cincinnati, OH (US);

Inventors:

Thanh Huu Nguyen, North Billerica, MA (US);

Cheryl Ann Sayer, Lowell, MA (US);

Assignee:

Milacron LLC, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/28 (2006.01); B29C 45/27 (2006.01);
U.S. Cl.
CPC ...
B29C 45/2806 (2013.01); B29C 45/2725 (2013.01); B29C 45/2737 (2013.01); B29C 2045/2762 (2013.01); B29C 45/278 (2013.01);
Abstract

An injection molding apparatus and hot runner system are disclosed. The injection molding apparatus includes a plurality of mold plates in which the hot runner system is received. A manifold receives molding material and has a manifold channel that extends between an inlet and an outlet. A nozzle delivers moldable material to a mold cavity. The nozzle has a nozzle channel in fluid communication between the manifold channel and the mold cavity. A valve pin seal is located at the upstream end of the nozzle, and a valve pin that is connected to an actuator extends through the manifold and nozzle is slidably received in the valve pin seal. The hot runner system further includes a thermal bridge that is in conductive thermal communication with the valve pin seal and a cooled one of the plurality of mold plates.


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