The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Feb. 28, 2022
Watlow Electric Manufacturing Company, St. Louis, MO (US);
Martin Wallinger, Abtenau, AT;
Gerhard Schefbänker, Scheffau am Tennengebirge, AT;
Wolfgang Pöschl, Abtenau, AT;
Gernot Antosch, Hallein, AT;
Reinhardt Lehnert, Ubstadt-Weiher, DE;
Michael Kübler, Untergruppenbach-Oberheinriet, DE;
August Burr, Bretzfeld, DE;
Watlow Electric Manufacturing Company, St. Louis, MO (US);
Abstract
A molding system is provided, which includes at least one mold part and a heating and cooling module. The at least one mold part defines a mold cavity having an opening. The heating and cooling module is inserted into the opening to close the mold cavity. The heating and cooling module includes a die insert defining a mold surface, a layered heater for heating the mold surface, and a cooling unit for cooling the mold surface. The layered heater is disposed between the die insert and the cooling unit and includes functional layers formed directly on a surface of the cooling unit or a surface of the die insert opposite to the mold surface by using layered or layering processes selected from a group consisting of thick film, thin film, thermal spray and sol-gel processes.