The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Sep. 11, 2020
Applicant:
Lifco Industrie, Saint-Etienne, FR;
Inventors:
Constantin Iacob, Saint Georges sur Fontaine, FR;
Sébastien Bucher, Saint Etienne, FR;
Assignee:
LIPCO INDUSTRIE, Saint-Etienne, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B23K 35/30 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0222 (2013.01); B23K 35/3006 (2013.01); B23K 35/302 (2013.01); B23K 35/3033 (2013.01); H05K 1/0271 (2013.01); H05K 3/3436 (2013.01); H05K 3/3473 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/0435 (2013.01);
Abstract
The present invention relates to a method for manufacturing composite solder balls that are metallized on the surface and calibrated, these balls comprising a core consisting of a spherical support particle of diameter Dmade of expanded polystyrene and having an intergranular porosity of at least 50%, and a shell covering said support particle and formed by a plurality of metallic surface layers. The present invention also relates to balls that can be obtained by the method according to the invention, as well as to the use thereof for the assembly of electronic boards.