The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Oct. 21, 2020
Applicants:

Jfe Steel Corporation, Tokyo, JP;

Tokin Corporation, Sendai, JP;

National Institute of Advanced Industrial Science and Technology, Tokyo, JP;

Inventors:

Naomichi Nakamura, Tokyo, JP;

Makoto Nakaseko, Tokyo, JP;

Takuya Takashita, Tokyo, JP;

Mineo Muraki, Tokyo, JP;

Hoshiaki Terao, Niigata, JP;

Raita Wada, Niigata, JP;

Akiri Urata, Sendai, JP;

Yu Kanamori, Sendai, JP;

Makoto Yamaki, Sendai, JP;

Koichi Okamoto, Sendai, JP;

Toshinori Tsuda, Sendai, JP;

Shoichi Sato, Sendai, JP;

Kimihiro Ozaki, Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/14 (2006.01); B22F 1/00 (2022.01); B22F 1/02 (2006.01); B22F 1/08 (2022.01); B22F 1/102 (2022.01); B22F 1/16 (2022.01); B22F 3/00 (2021.01); B22F 3/02 (2006.01); B22F 3/03 (2006.01); C22C 33/02 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/16 (2006.01); C22C 45/02 (2006.01); H01F 1/153 (2006.01); H01F 3/08 (2006.01); H01F 41/02 (2006.01); H01F 27/255 (2006.01);
U.S. Cl.
CPC ...
B22F 3/14 (2013.01); B22F 1/00 (2013.01); B22F 1/08 (2022.01); B22F 1/102 (2022.01); B22F 1/16 (2022.01); B22F 3/00 (2013.01); B22F 3/02 (2013.01); B22F 3/03 (2013.01); C22C 33/02 (2013.01); C22C 38/00 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/16 (2013.01); C22C 45/02 (2013.01); H01F 1/15308 (2013.01); H01F 1/15325 (2013.01); H01F 1/15333 (2013.01); H01F 1/15375 (2013.01); H01F 3/08 (2013.01); H01F 41/0246 (2013.01); B22F 2301/35 (2013.01); B22F 2304/10 (2013.01); C22C 2200/02 (2013.01); C22C 2200/04 (2013.01); C22C 2202/02 (2013.01); H01F 27/255 (2013.01);
Abstract

Provided is a method of manufacturing a soft magnetic dust core. The method includes: preparing coated powder including amorphous powder made of an Fe-B-Si-P-C-Cu-based alloy, an Fe-B-P-C-Cu-based alloy, an Fe-B-Si-P-Cu-based alloy, or an Fe-B-P-Cu-based alloy, with a first initial crystallization temperature Tand a second initial crystallization temperature T; and a coating formed on a surface of particles of the amorphous powder; applying a compacting pressure to the coated powder or a mixture of the coated powder and the amorphous powder at a temperature equal to or lower than T−100 K; and heating to a maximum end-point temperature equal to or higher than T−50 K and lower than Twith the compacting pressure being applied.


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