The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Aug. 10, 2021
Applicant:
Solum Co., Ltd., Gyeonggi-do, KR;
Inventors:
Jun Kyu Lee, Gyeonggi-do, KR;
Jeong Man Han, Gyeonggi-do, KR;
Su Young Kim, Gyeonggi-do, KR;
Yong Woo Kang, Gyeonggi-do, KR;
Sang Keun Ji, Gyeonggi-do, KR;
Dong Kyun Ryu, Seoul, KR;
Assignee:
SOLUM CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 1/02 (2006.01); H05K 13/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H05K 1/0203 (2013.01); H05K 13/00 (2013.01); H05K 2201/0212 (2013.01); H05K 2203/1316 (2013.01);
Abstract
The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.