The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Apr. 23, 2020
Applicants:

Hongqisheng Precision Electronics (Qinhuangdao) Co.,ltd., Qinhuangdao, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Jian-Yi Hao, Shenzhen, CN;

Yan-Lu Li, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01R 12/58 (2011.01); H05K 3/36 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/14 (2013.01); H01R 12/58 (2013.01); H05K 3/36 (2013.01); H05K 3/42 (2013.01); H05K 2201/0335 (2013.01);
Abstract

The present disclosure provides a method for manufacturing a board-to-board connection structure. The method includes defining a first through hole in a first circuit board, disposing a first connector within the first through hole by a first conductive paste, and connecting the first connector to a second circuit board on which a second connector is installed, thereby realizing a connection of the two circuit boards, and reducing a height of the two circuit boards after the connection. That is, the height of the board-to-board connection structure is reduced. Additionally, since the first connector is received within the first through hole, the first connector is not easy to be damaged and oxidized. The present disclosure further provides a board-to-board connection structure manufactured by the above method.


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