The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Mar. 04, 2022
Applicant:

Delta Electronics (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Shouyu Hong, Shanghai, CN;

Haibin Xu, Shanghai, CN;

Tao Wang, Shanghai, CN;

Ganyu Zhou, Shanghai, CN;

Xin Zou, Shanghai, CN;

Liping Sun, Shanghai, CN;

Chao Ji, Shanghai, CN;

Weiqiang Zhang, Shanghai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H02M 7/00 (2006.01); H02M 7/537 (2006.01); H05K 1/02 (2006.01); H01L 25/11 (2006.01); H01L 25/18 (2023.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/025 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H05K 1/0204 (2013.01); H05K 1/0216 (2013.01); H05K 1/0243 (2013.01); H01L 25/115 (2013.01); H01L 25/18 (2013.01); H05K 1/181 (2013.01); H05K 7/20509 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A power module and a carrier board are disclosed. The carrier board includes a circuit board body and a prefabricated substrate. The circuit board body includes a wiring layer. The prefabricated substrate is embedded in the circuit board body and includes an insulation layer and a metal layer, the metal layer is disposed on the insulation layer. The insulation layer is formed by a ceramic material. The metal layer is connected to the insulation layer through a sintering process. A surface of the insulation layer, which has contact with the at least one metal layer, has at least a part exposed outside of the at least one metal layer, the part of the insulation layer exposed to the outside of the at least one metal layer is an outer edge portion, and the outer edge portion is extended into the circuit board body along a horizontal direction.


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