The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Jul. 20, 2022
Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Takuro Suyama, Ina, JP;

Ken Yamamoto, Nagano, JP;

Takatoshi Igarashi, Nagano, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/54 (2023.01); A61B 1/04 (2006.01); A61B 1/05 (2006.01); H04N 23/50 (2023.01);
U.S. Cl.
CPC ...
H04N 23/54 (2023.01); A61B 1/04 (2013.01); A61B 1/051 (2013.01); H04N 23/555 (2023.01);
Abstract

An image pickup apparatus includes a stacked device in which a plurality of semiconductor devices respectively including a plurality of through electrodes are stacked, a first semiconductor device, among the plurality of semiconductor devices, in which thermal resistance of a through electrode is highest among the plurality of through electrodes, is disposed in front of a first surface on which a first circuit that is one of the semiconductor circuits having a largest heat generation amount is formed, the plurality of through electrodes of the first semiconductor device are conformal vias, and the plurality of through electrodes of semiconductor devices other than the first semiconductor device are filled vias.


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