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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12027676 B1

PDFFull Text
Date of Patent:
Jul. 02, 2024

Filed:

Dec. 10, 2021

Powertrain system with wireless communication nodes and integrated rf shield guide layer

Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Fiona E. Meyer-Teruel, Detroit, MI (US);

Aseim M. Elfrgani, Sterling Heights, MI (US);

Christopher A. O'Brien, Royal Oak, MI (US);

Sony Mathews, Macomb, MI (US);

Hatem Elgothamy, Westland, MI (US);

Assignee:

GM Global Technology Operations LLC, Detroit, MI (US);

Attorney:

Quinn IP Law

Primary Examiner:

Binh B Tran

Int. Cl.
CPC ...
H05K 1/14 (2006.01); B60K 1/04 (2019.01); B60L 53/20 (2019.01); H01M 10/42 (2006.01); H01M 10/48 (2006.01); H01M 50/209 (2021.01); H01M 50/249 (2021.01); H01M 50/519 (2021.01); H01M 50/569 (2021.01); H01Q 1/52 (2006.01); H02K 7/00 (2006.01); H02K 11/00 (2016.01); H02K 11/33 (2016.01); H04B 7/24 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01M 10/4257 (2013.01); B60K 1/04 (2013.01); B60L 53/20 (2019.02); H01M 10/482 (2013.01); H01M 50/209 (2021.01); H01M 50/249 (2021.01); H01M 50/519 (2021.01); H01M 50/569 (2021.01); H01Q 1/526 (2013.01); H02K 7/006 (2013.01); H02K 11/0094 (2013.01); H02K 11/33 (2016.01); H04B 7/24 (2013.01); H05K 1/142 (2013.01); H05K 9/006 (2013.01); H05K 9/0084 (2013.01); H01M 2010/4271 (2013.01); H01M 2010/4278 (2013.01); H01M 2220/20 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10098 (2013.01);
Abstract

An enclosed electrical device such as a battery pack for an electric powertrain system includes an enclosure having a tray and cover. The tray and cover together define an enclosure cavity. A radio frequency (RF) receiving node is located within the cavity. Printed circuit board assemblies (PCBAs) include an RF transmitting node. The PCBAs(s) are spaced apart from one another within the cavity. An RF shield guide layer is positioned between the PCBAs and the cover, such that the RF shield guide layer covers the PCBAs without covering the RF transmitting node. A battery pack and an electric powertrain system include the RF shield guide layer.

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