The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Aug. 14, 2023
Applicant:

Semiconductor Components Industries, Llc, Scottsdale, AZ (US);

Inventor:

Swarnal Borthakur, Boise, ID (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); G02B 3/06 (2006.01); H01L 27/146 (2006.01); H01L 31/0232 (2014.01); H01L 31/055 (2014.01); H01L 31/107 (2006.01); H04N 25/63 (2023.01);
U.S. Cl.
CPC ...
H01L 31/02027 (2013.01); G02B 3/06 (2013.01); H01L 27/14605 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14629 (2013.01); H01L 27/1463 (2013.01); H01L 27/14643 (2013.01); H01L 27/14649 (2013.01); H01L 31/02327 (2013.01); H01L 31/055 (2013.01); H01L 31/107 (2013.01); H01L 27/1464 (2013.01); H04N 25/63 (2023.01);
Abstract

An imaging device may include single-photon avalanche diodes (SPADs). To improve the sensitivity and signal-to-noise ratio of the SPADs, light scattering structures may be formed in the semiconductor substrate to increase the path length of incident light through the semiconductor substrate. The light scattering structures may include a low-index material formed in trenches in the semiconductor substrate. The light scattering structures may have different sizes and/or a layout with a non-uniform number of structures per unit area. SPAD devices may also include isolation structures in a ring around the SPADs to prevent crosstalk. The isolation structures may include metal-filled deep trench isolation structures. The metal filler may include tungsten.


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