The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
May. 15, 2019
Board of Trustees of Michigan State University, East Lansing, MI (US);
Ioannis Papapolymerou, Okemos, MI (US);
Premjeet Chahal, Okemos, MI (US);
John D. Albrecht, Okemos, MI (US);
Michael Thomas Craton, Lansing, MI (US);
Christopher Oakley, Lansing, MI (US);
Board of Trustees of Michigan State University, East Lansing, MI (US);
Abstract
A method of manufacturing an interconnect packaging structure is provided. In one aspect, the method includes forming a first body defining a cavity around at least one integrated circuit using an additive manufacturing machine, depositing a conductive transmission line on the first body and electrically coupling the conductive transmission line and the at least one integrated circuit with a conductive interconnect.