The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Mar. 29, 2019
Mitsubishi Electric Corporation, Tokyo, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
A semiconductor module parallel circuit includes: a plurality of power semiconductor modules; and a multilayer substrate that interconnects the plurality of power semiconductor modules, each of the power semiconductor modules includes: a power semiconductor switching element; a first signal terminal connected to a gate potential of the power semiconductor switching element; and a second signal terminal connected to a source potential of the power semiconductor switching element, the multilayer substrate includes: an external connection terminal; first signal terminal connection patterns connected to the first signal terminals of the power semiconductor modules; and second signal terminal connection patterns connected to the second signal terminals of the power semiconductor modules, and inductances of gate wiring for the plurality of power semiconductor modules, from the external connection terminal to the first signal terminal connection pattern and from the second signal terminal connection pattern to the external connection terminal are equal to one another.