Electronic device and electronic device mounting structure

Abstract

An electronic device includes: an electronic element having an element obverse surface and an element reverse surface spaced apart from each other in a first direction, the element obverse surface being provided with an obverse-surface electrode; a resin member having a resin reverse surface facing in a same direction as the element reverse surface, the resin member covering the electronic element; and an electrically conductive member supporting the electronic element and electrically connected to the electronic element. The electrically conductive member has a first exposed region, a second exposed region and a third exposed region each of which is exposed from the resin reverse surface. The resin member has a first resin side surface and a second resin side surface connected to each other and standing up from the resin reverse surface. As viewed in the first direction, the first exposed region is located at a corner portion where the first resin side surface and the second resin side surface are connected. As viewed in the first direction, the second exposed region is located side by side with the first exposed region in a second direction extending along the first resin side surface. The third exposed region is located between the first exposed region and the second exposed region in the second direction. As viewed in the first direction, the third exposed region has a larger area than each of the first exposed region and the second exposed region.