The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Jul. 19, 2021
Applicant:

Lenovo (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Seiji Yamasaki, Yokohama, JP;

Masaaki Bandoh, Yokohama, JP;

Shigeru Yuzawa, Yokohama, JP;

Hua Wang, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); G06F 1/20 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); G06F 1/203 (2013.01); H05K 1/181 (2013.01); H01L 2023/4087 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10598 (2013.01);
Abstract

An electronic device includes: a circuit board having a mounting face, on which an electronic component is mounted; a heat receiver including a heat receiving plate opposed to the electronic component; and a fastening mechanism that fixes the heat receiver to the circuit board. The fastening mechanism includes a receiver having a proximal end and a distal end, the receiver having a mounting hole penetrating from the proximal end to the distal end; and a fastener that is inserted into the mounting hole for fastening to the receiver to press the heat receiver. The receiver is surface-mounted on the mounting face by soldering with the proximal end facing the mounting face.


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