The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Mar. 15, 2021
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Akiyoshi Aoyagi, Kanagawa, JP;

Ken Kikuchi, Tokyo, JP;

Katsuhiro Tomoda, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); F21V 19/00 (2006.01); G09G 3/32 (2016.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 22/22 (2013.01); F21V 19/003 (2013.01); G09G 3/32 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); F21Y 2115/10 (2016.08); G09G 2300/0408 (2013.01); G09G 2300/0421 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (); a plurality of light-emitting elements () arranged in a matrix on the wiring substrate; and a plurality of drive ICs () that are arranged in a matrix on the wiring substrate, and control light emission of the light-emitting elements. The light-emitting elements and the drive ICs are mounted on a same surface. The wiring substrate includes a plurality of first wiring lines () on a mounting surface where the light-emitting elements and the dive ICs are mounted. The first wiring lines electrically couple the light-emitting elements to the drive ICs.


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