The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Sep. 01, 2021
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventors:
Assignee:
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67017 (2013.01); H01L 21/02041 (2013.01); H01L 21/306 (2013.01); H01L 21/67057 (2013.01); H01L 21/67086 (2013.01); H01L 21/68771 (2013.01); H01L 21/6708 (2013.01);
Abstract
In one embodiment, a semiconductor manufacturing apparatus includes a substrate holder configured to hold a plurality of substrates such that the substrates are arranged in parallel to each other. The apparatus further includes a fluid injector including a plurality of openings that inject fluid to areas in which distances from surfaces of the substrates are within distances between centers of the substrates adjacent to each other, the fluid injector being configured to change injection directions of the fluid injected from the openings in planes that are parallel to the surfaces of the substrates by self-oscillation.