The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Dec. 23, 2021
Applicant:
Hanon Systems Efp Deutschland Gmbh, Bad Homburg v.d. Höhe, DE;
Inventor:
Luigi Aulisio, Campiglione Fenile, IT;
Assignee:
HANON SYSTEMS EFP DEUTSCHLAND GMBH, Bad Homburg V.D. Höhe, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/38 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 2/06 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 4/38 (2013.01);
Abstract
A circuit having a printed circuit board and at least one multilayer ceramic capacitor (MLCC) is described, characterized in that the printed circuit board has at least one opening in the region of the projection of the MLCC on the printed circuit board. The opening is not filled with any material and in the event of the MLCC malfunctioning it essentially prevents heat from accumulating between the MLCC and the printed circuit board.