logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12027190 B1

PDFFull Text
Date of Patent:
Jul. 02, 2024

Filed:

Oct. 28, 2021

Method of for bonding noble metal structure with a dielectric layer using an adhesive layer

Applicant:

Seagate Technology Llc, Fremont, CA (US);

Inventor:

Xiaoyue Huang, Edina, MN (US);

Assignee:

Seagate Technology LLC, Fremont, CA (US);

Attorney:

Mueting Raasch Group

Primary Examiner:

Asok K Sarkar

Int. Cl.
CPC ...
G11B 5/40 (2006.01); C23C 14/02 (2006.01); G11B 5/255 (2006.01); G11B 5/31 (2006.01); G11B 5/73 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01); G11B 5/00 (2006.01);
U.S. Cl.
CPC ...
G11B 5/7375 (2019.05); C23C 14/021 (2013.01); G11B 5/255 (2013.01); G11B 5/3133 (2013.01); G11B 5/314 (2013.01); G11B 5/40 (2013.01); H01L 21/0206 (2013.01); H01L 21/02065 (2013.01); H01L 21/0228 (2013.01); H01L 21/28562 (2013.01); G11B 2005/0021 (2013.01); G11B 2209/02 (2013.01); G11B 2220/2516 (2013.01); Y10T 428/1164 (2015.01); Y10T 428/1193 (2015.01);
Abstract

A first layer that includes a metal seed layer, a refractive seed or a refractive dopant is formed on a dielectric substrate. A peg of a near-field transducer is formed on the first layer such that a first surface of the peg is formed on and is in contact with the metal seed. An adhesive layer is formed over the peg using atomic layer deposition. The adhesive layer includes alumina and is 4 nm or less in thickness. A silicon dioxide overcoat is deposited over the adhesive layer. The alumina bonds the silicon dioxide to the peg.

Find Patent Forward Citations

Huang, Xiaoyue. (2024). Method of for bonding noble metal structure with a dielectric layer using an adhesive layer (U.S. Patent No. 12027190). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12027190

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…