The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Nov. 15, 2022
Applicant:

Ohmplus Technology Inc., New Taipei, TW;

Inventors:

Hsi-Tseng Chou, New Taipei, TW;

Chih-Wei Chiu, New Taipei, TW;

Zhao-He Lin, New Taipei, TW;

Jake Waldvogel Liu, New Taipei, TW;

Assignee:

Ohmplus Technology Inc., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/302 (2006.01); G01R 31/00 (2006.01); G01R 31/3183 (2006.01);
U.S. Cl.
CPC ...
G01R 31/3025 (2013.01); G01R 31/002 (2013.01); G01R 31/3183 (2013.01);
Abstract

The invention describes a system for testing antenna-in-package (AiP) modules and a method for using the same. Firstly, AiP modules respectively receive RF signals from a testing transmitting antenna. Then, at least one of the power and the phase of each of the RF signals is adjusted to generate modulated RF amplified signals as recognition tags with difference. The RF amplified signals are received from each control integrated circuit (IC) and the power of the modulated RF amplified signals is summed to generate a net mixed test signal. Finally, the test signal is received and RF properties corresponding to at least one of the power and the phase of each of the RF amplified signals as recognition tags are obtained. The method can simultaneously test a plurality of AiP modules to shorten the test time.


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