The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Sep. 04, 2020
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Keith D. Humfeld, Federal Way, WA (US);

Morteza Safai, Newcastle, WA (US);

Assignee:

The Boeing Company, Arlington, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 17/02 (2006.01); B29C 70/02 (2006.01); B29C 70/30 (2006.01); B29C 70/38 (2006.01); B29C 70/54 (2006.01); B32B 5/12 (2006.01); B32B 5/24 (2006.01); C08J 5/04 (2006.01); C08J 5/24 (2006.01); C08K 3/013 (2018.01); G01N 29/04 (2006.01); G01N 29/06 (2006.01); G01N 29/07 (2006.01); G01N 29/11 (2006.01);
U.S. Cl.
CPC ...
G01B 17/02 (2013.01); B29C 70/025 (2013.01); B29C 70/386 (2013.01); B29C 70/54 (2013.01); B32B 5/12 (2013.01); B32B 5/24 (2013.01); C08J 5/04 (2013.01); C08J 5/042 (2013.01); C08J 5/243 (2021.05); C08K 3/013 (2018.01); G01N 29/0654 (2013.01); G01N 29/07 (2013.01); G01N 29/11 (2013.01); B29C 70/30 (2013.01); B29C 70/38 (2013.01); B29K 2995/0046 (2013.01); B29K 2995/0082 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2264/10 (2013.01); B32B 2307/51 (2013.01); C08K 2201/011 (2013.01); G01N 29/04 (2013.01); G01N 2291/011 (2013.01); G01N 2291/015 (2013.01); G01N 2291/0231 (2013.01); G01N 2291/0235 (2013.01); G01N 2291/02854 (2013.01);
Abstract

Systems and methods are provided for ultrasonic imaging of composite parts. One embodiment is a method that includes providing an object having multiple layers of fibers and resin, inducing ultrasonic waves at locations along the object, and attenuating the ultrasonic waves at the regions due to regions interspersed among the layers that each exhibit an elastic modulus distinct from an elastic modulus of the fibers and distinct from an elastic modulus of the matrix. The method further includes receiving the attenuated ultrasonic waves, and analyzing the attenuated ultrasonic waves to determine depths of the regions.


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