The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Oct. 07, 2022
GE Infrastructure Technology Llc, Greenville, SC (US);
Johannes Clemens Schab, Birr-Aargau, CH;
Sophie Betty Claire Duval, Baden-Aargau, CH;
Piero-Daniele Grasso, Birr-Aargau, CH;
Julien Rene Andre Zimmermann, Birr-Aargau, CH;
Norbert Lucke, Birr-Aargau, CH;
GE INFRASTRUCTURE TECHNOLOGY LLC, Greenville, SC (US);
Abstract
A system for analyzing layer thickness of a multilayer component is provided. The system includes: an opening forming device configured to create an opening having a predefined geometry partially into the multilayer component at a selected location on a surface of the multilayer component, where the multilayer component includes a plurality of material layers including a substrate and a bond coat and the opening exposes each of the plurality of material layers, and an imaging device configured to create an image of the exposed plurality of material layers in the opening. The system is configured to calculate at least a thickness of the bond coat of the exposed plurality of material layers from the image and based on the predefined geometry of the opening. The system may also include a repairing device configured to repair the opening, allowing the multilayer component to be used for an intended purpose.