The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Feb. 11, 2020
Applicants:

Qingdao Haier Special Refrigerator Co., Ltd, Shandong, CN;

Qingdao Haier Refrigerator Co., Ltd., Shandong, CN;

Haier Smart Home Co., Ltd., Shandong, CN;

Inventors:

Haijuan Wang, Qingdao, CN;

Kunkun Zhao, Qingdao, CN;

Sen Mu, Qingdao, CN;

Peng Li, Qingdao, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25D 11/02 (2006.01); F25D 23/12 (2006.01); H05B 6/12 (2006.01);
U.S. Cl.
CPC ...
F25D 11/02 (2013.01); F25D 23/12 (2013.01); H05B 6/12 (2013.01);
Abstract

A refrigerating and freezing device () is provided, which includes: a cabinet body, wherein at least one storage compartment () is defined in the cabinet body, and a heating cavity configured to accommodate a to-be-processed object is defined in one of the storage compartments (); and an electromagnetic heating device, configured to provide electromagnetic waves into the heating cavity to heat the to-be-processed object, wherein the electromagnetic heating device is provided with an electromagnetic generation module () configured to generate an electromagnetic wave signal and a power supply module () configured to provide a power source to the electromagnetic generation module (). An accommodation groove () with a backward opening is formed in a back of the cabinet body (), the backward opening of the accommodation groove () is covered with a cover body () to define an accommodation space () between the accommodation groove () and the cover body (), and heat dissipation holes configured to achieve communication between the accommodation space () and an external environment where the cabinet body () is located are formed in the cover body (). The power supply module () is disposed in the accommodation space (), and a heat dissipation fan () is further disposed in the accommodation space () and is configured to drive airflow to flow between the accommodation space () and the external environment where the cabinet body () is located through the heat dissipation holes, so as to dissipate heat from the power supply module (), and the heat dissipation efficiency is improved.


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