The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Jun. 24, 2021
Applicant:
Hkc Corporation Limited, Shenzhen, CN;
Inventors:
Yuming Xia, Shenzhen, CN;
Chongwei Tang, Shenzhen, CN;
Assignee:
HKC CORPORATION LIMITED, Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09C 1/30 (2006.01); C09C 1/36 (2006.01); C09C 3/00 (2006.01); C09C 3/06 (2006.01); C09C 3/10 (2006.01); C09J 7/30 (2018.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09C 1/3054 (2013.01); C09C 1/3072 (2013.01); C09C 1/309 (2013.01); C09C 1/3661 (2013.01); C09C 1/3676 (2013.01); C09C 3/006 (2013.01); C09C 3/063 (2013.01); C09C 3/10 (2013.01); C09J 7/30 (2018.01); C01P 2004/34 (2013.01); C01P 2004/84 (2013.01); C01P 2006/40 (2013.01); C09J 2203/326 (2013.01); C09J 2301/408 (2020.08);
Abstract
The disclosure relates to a conductive particle and a manufacturing method thereof, an adhesive and an application thereof. The conductive particle includes a core, a conductive carbon layer and a conductive polymer layer. The conductive carbon layer covers the core, and the conductive polymer layer is provided on the conductive carbon layer. The conductivity of the conductive particle is higher.