The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Apr. 27, 2021
Applicant:
Brewer Science, Inc., Rolla, MO (US);
Inventors:
Assignee:
Brewer Science, Inc., Rolla, MO (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 73/00 (2006.01); B32B 7/12 (2006.01); B32B 17/06 (2006.01); B32B 43/00 (2006.01); C09J 179/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C08G 73/00 (2013.01); B32B 7/12 (2013.01); B32B 17/06 (2013.01); B32B 43/006 (2013.01); C09J 179/00 (2013.01); H01L 21/6835 (2013.01); B32B 2307/412 (2013.01); B32B 2457/00 (2013.01); H01L 2221/68381 (2013.01);
Abstract
The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.