The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Aug. 06, 2021
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Heqiang Zhang, Shanghai, CN;
Chongjian Song, Shanghai, CN;
Zuohe Wang, Shanghai, CN;
Chongyang Sun, Shanghai, CN;
Assignee:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/50 (2006.01); C08F 210/10 (2006.01); C08F 220/18 (2006.01); C08J 5/12 (2006.01); C08K 5/07 (2006.01); C08K 5/5397 (2006.01);
U.S. Cl.
CPC ...
C08F 2/50 (2013.01); C08F 210/10 (2013.01); C08F 220/1806 (2020.02); C08F 220/1811 (2020.02); C08J 5/124 (2013.01); C08K 5/07 (2013.01); C08K 5/5397 (2013.01);
Abstract
The present invention provides a light curable (meth)acrylate resin composition for thermoplastic elastomer bonding. The light curable (meth)acrylate resin composition of the present invention comprises: a (meth)acrylic monomer, a polyolefin (meth)acrylate oligomer having a viscosity of 200 000 to 2 500 000 mPa*s at 25° C., and a photoinitiator. The present invention also provides a cured product of the light curable (meth)acrylate resin composition and a use of the composition.