The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Jul. 26, 2021
Canon Kabushiki Kaisha, Tokyo, JP;
Yusuke Hashimoto, Kanagawa, JP;
Junichiro Iri, Kanagawa, JP;
Makoto Watanabe, Kanagawa, JP;
Masatomo Ojima, Saitama, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A manufacturing method of a liquid ejection head includes steps of providing an ejection orifice forming member on one surface of a wafer, with an energy-generating element being provided on the one surface of the wafer; forming a recess on the other surface of the wafer; and dicing the wafer along a plurality of dicing lines. The plurality of dicing lines include a dicing line extending in one direction and a dicing line extending in a direction crossing the one direction, and the recess is formed on each of positions overlapping the dicing lines except for an intersection part where the dicing line extending in the one direction intersects the dicing line extending in the direction crossing the one direction.