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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12023892 B1

PDFFull Text
Date of Patent:
Jul. 02, 2024

Filed:

Dec. 06, 2019

Structure body, structure body manufacturing method, and electronic apparatus

Applicants:

Sony Group Corporation, Tokyo, JP;

Tohoku University, Miyagi, JP;

Inventors:

Yuichi Takahashi, Tokyo, JP;

Shohei Abe, Tokyo, JP;

Gen Yonezawa, Tokyo, JP;

Takehito Shimatsu, Miyagi, JP;

Miyuki Uomoto, Miyagi, JP;

Assignees:

Sony Group Corporation, Tokyo, JP;

Tohoku University, Miyagi, JP;

Attorney:

Sheridan Ross PC

Primary Examiner:

Zachary M Davis

Int. Cl.
CPC ...
B32B 15/04 (2006.01); C03C 27/04 (2006.01); C04B 37/02 (2006.01); H01L 33/50 (2010.01); F21S 41/176 (2018.01); G03B 21/20 (2006.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
B32B 15/04 (2013.01); C03C 27/04 (2013.01); C04B 37/023 (2013.01); H01L 33/507 (2013.01); C04B 2237/32 (2013.01); C04B 2237/40 (2013.01); C04B 2237/52 (2013.01); F21S 41/176 (2018.01); G03B 21/204 (2013.01); H01L 33/501 (2013.01); H01L 33/58 (2013.01);
Abstract

A structure body according to an embodiment of the present disclosure includes: a first base having one surface, and having a density lower than a density that is determined by a crystal structure and a composition of a constituent material; a second base disposed to face the one surface of the first base; and a buffer layer provided between the first base and the second base, and containing at least a metal element.

Find Patent Forward Citations

Takahashi, Yuichi. (2024). Structure body, structure body manufacturing method, and electronic apparatus (U.S. Patent No. 12023892). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12023892

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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