The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Oct. 17, 2022
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Vipul Kumar Gupta, Guilderland, NY (US);

Natarajan Chennimalai Kumar, Schenectady, NY (US);

Anthony Joseph Vinciquerra, Rexford, NY (US);

Laura Cerully Dial, Clifton Park, NY (US);

Voramon Supatarawanich Dheeradhada, Latham, NY (US);

Timothy Hanlon, Glenmont, NY (US);

Lembit Salasoo, Niskayuna, NY (US);

Xiaohu Ping, Clifton Park, NY (US);

Subhrajit Roychowdhury, Schenectady, NY (US);

Justin John Gambone, Schenectady, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/153 (2017.01); B22F 10/20 (2021.01); B22F 10/31 (2021.01); B22F 10/85 (2021.01); B29C 64/393 (2017.01); B33Y 50/00 (2015.01); B22F 3/24 (2006.01); B22F 10/28 (2021.01); B22F 10/30 (2021.01); B22F 10/366 (2021.01); B22F 12/90 (2021.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B29C 64/153 (2017.08); B22F 10/20 (2021.01); B22F 10/31 (2021.01); B22F 10/85 (2021.01); B29C 64/393 (2017.08); B33Y 50/00 (2014.12); B22F 2003/245 (2013.01); B22F 10/28 (2021.01); B22F 10/30 (2021.01); B22F 10/366 (2021.01); B22F 12/90 (2021.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

According to some embodiments, system and methods are provided comprising receiving, via a communication interface of a parameter development module comprising a processor, a defined geometry for one or more parts, wherein the parts are manufactured with an additive manufacturing machine, and wherein a stack is formed from one or more parts; fabricating the one or more parts with the additive manufacturing machine based on a first parameter set; collecting in-situ monitoring data from one or more in-situ monitoring systems of the additive manufacturing machine for one or more parts; determining whether each stack should receive an additional part based on an analysis of the collected in-situ monitoring data; and fabricating each additional part based on the determination the stack should receive the additional part. Numerous other aspects are provided.


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