The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Jun. 05, 2019
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A laser machining method performing cutting machining to cut a composite material over a thickness direction thereof by applying a laser beam to the composite material. The method includes applying the laser beam from one side in the thickness direction of the composite material so as to form a first cutout in the composite material; and applying the laser beam from the other side in the thickness direction of the composite material, forming a second cutout in the composite material at a position opposing the first cutout, connecting the second cutout to the first cutout, and cutting the composite material. The first cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the first cutout. The second cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the second cutout.