The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Jul. 15, 2022
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Mohammed S. Shaarawi, Corvallis, OR (US);
James McKinnell, Corvallis, OR (US);
David A. Champion, Corvallis, OR (US);
Vladek P. Kasperchik, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 30/00 (2015.01); B22F 1/05 (2022.01); B22F 3/10 (2006.01); B22F 5/00 (2006.01); B22F 10/00 (2021.01); B22F 10/14 (2021.01); B22F 10/32 (2021.01); B22F 10/43 (2021.01); B22F 10/47 (2021.01); B22F 10/64 (2021.01); B22F 10/68 (2021.01); B22F 10/85 (2021.01); B29C 64/165 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 40/00 (2020.01); B33Y 40/20 (2020.01); B33Y 50/02 (2015.01); B33Y 70/00 (2020.01); B33Y 70/10 (2020.01); B33Y 80/00 (2015.01); C09D 11/033 (2014.01); C09D 11/38 (2014.01); B29K 505/00 (2006.01);
U.S. Cl.
CPC ...
B22F 5/003 (2013.01); B22F 1/05 (2022.01); B22F 3/1021 (2013.01); B22F 10/00 (2021.01); B22F 10/14 (2021.01); B22F 10/32 (2021.01); B22F 10/43 (2021.01); B22F 10/47 (2021.01); B22F 10/64 (2021.01); B22F 10/68 (2021.01); B22F 10/85 (2021.01); B29C 64/165 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 40/20 (2020.01); B33Y 50/02 (2014.12); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01); B33Y 80/00 (2014.12); C09D 11/033 (2013.01); C09D 11/38 (2013.01); B22F 2201/013 (2013.01); B22F 2302/10 (2013.01); B22F 2302/45 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B29K 2505/00 (2013.01);
Abstract
An apparatus is disclosed to create a breakaway junction for 3D printed parts. Powder is spread along a target zone, such as a build bed. A liquid functional agent is selectively dispensed upon the powder to form a 3D object, a supporting part, and the breakaway junction between them.